AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan
Advanced chip packaging—not raw wafer production—is emerging as the critical constraint for AI compute scaling. With NVIDIA controlling TSMC's most advanced packaging lines, supply chain resilience becomes a geopolitical and competitive vulnerability for every AI company building infrastructure.
Why it ranks · · NVIDIA has reserved majority of TSMC's most advanced packaging capacity · 2026-04-08
Read full story