ToolsThe story, in brief
Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging
Cadence just shipped AuraStack—an AI Super Agent for chip design at system level. This isn't a chatbot. It's automating PCB and advanced packaging workflows.
The KeyNews take
Why it matters
Cadence is moving AI from model benchmarks into production engineering workflows. For hardware design teams, this represents a shift from AI-assisted to AI-driven chip development—directly impacting time-to-market and competitive positioning in advanced packaging.
The key facts
5 to knowCadence announces AuraStack AI Super Agent
Focus: PCB design and advanced chip packaging workflows
System-level AI engineering automation
Product ship date: July 2026
Category: AI agent for hardware/chip design automation
Go to the source
Forbes Innovationforbes.com
Publisher excerpt: Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just announced its new AuraStack AI Super Agent.